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Magnetron Sputtering System

equipment explanation
Model Customed
Operating time SUN(00:00~24:00)
MON(00:00~24:00)
TUE(00:00~24:00)
WED(00:00~24:00)
THU(00:00~24:00)
FRI(00:00~24:00)
SAT(00:00~24:00)
Location 86391
inquiry Sumin Kim
010-5119-4578
carem0613@gmail.com
Reservation

Sputter deposition is a physical vapor deposition (PVD) method of thin film deposition by sputtering.
This involves ejecting material from a "target", a material source onto a "substrate" such as a silicon wafer.

 

System dimesion : 1800(L)x1500(D)x1500(H)mm included control rack
Substrate specification
  1) Sample holder material : STS304 or Graphite, etc
  2) Deposition sample size : 1 inch x 1 inch
Sputtering method : down type sputter
Base pressure in main chamber : ≤ 8 x 10^(-8) Torr
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