Center for Relativistic Laser Science

1. Equipment name

- Manual Die Bonder (수동 다이 본더)

2. Manufacture and Model

- TPT, 2017

- HD10

3. Purpose

- Sensor assemply for low temperature detector

- The epoxy can be pasted through epoxy stamping or exoxy dispensing

4. Specification and performance :

- Pick up tool and vacuum pump for pic and place

- Dual head for die-placement and for epoxy stamping

- Motorized and programmable Z-axis: > 10mm

- Bond force range: 10 ~ 150cN

- Bond time range: 1 ~ 20000 sec

- Heating temperature control: 0 ~ 120 ℃

5. Location and Picture :

IBS Headquarter C187 Microscope lab